A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor. Each chiplet provides only a portion of the processor's total functionality, and a set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This means constructing a larger, more complex system from smaller reusable building blocks.
Modern chiplet technology is revolutionizing semiconductor design by breaking large, monolithic processors into smaller specialized dies that can be mixed, matched, and integrated in a single package. This modular approach allows chipmakers to combine CPU cores, GPUs, AI accelerators, memory, I/O, and networking components using advanced packaging and high-speed interconnects. Real-world examples illustrate why such technology is needed, and a comparison between monolithic and chiplet technology is also made.